Thermal management
An approach to transferring and distributing heat through application-specific component geometries, with results measured by testing.
AN INDUSTRIAL MATERIALS PLATFORM
Five divisions.
One platform.
New possibilities.
Coolflow organizes its industrial work into five divisions: semiconductors, energy storage, materials, motion and thermal management, including heat sinks and dielectric parts. All of them build on the same platform of graphene formulations, industrial processing and test validation.
Each division has its own scope. Thermal, electrical and mechanical performance must be verified under each component’s operating conditions; the areas presented here are not certified commercial products.
FIVE DIVISIONS / ONE IDENTITY
- 01Thermal & DielectricThermal & dielectric
- 02Energy StorageEnergy storage
- 03MotionMotion
- 04SemiconductorSemiconductors
- 05MaterialsFormulations
01 / COOLFLOW DIVISIONS
One identity.
Five industrial fronts.
Each division has its own technical scope, applications and development stage. Select a division to see what is being studied.
DIVISION 01
Thermal & Dielectric
Thermal management and electrical insulation
The front that started Coolflow: parts that conduct heat and insulate electrically. The division covers heat sinks, components for LED lighting and designs where part geometry solves the thermal requirement.
Under study in this division
- Heat sinks and components for LED lighting
- Electrical insulation in components near circuits
- Combining thermal and electrical functions in one part
02 / THE TECHNOLOGY
A shared base.
Different applications.
The divisions share the same materials research: graphene compounds, electrical insulation and industrial processing. Performance depends on formulation, geometry and operating conditions.
Electrical insulation
A key property for components near circuits and power systems, to be verified in each application.
Industrial processing
Injection molding and extrusion are processing routes under consideration; feasibility and process settings must be verified for each formulation and part.
THERMAL APPLICATION TERMS
Heat sink, exchanger
and thermal interface.
People designing thermal management search using different names. Coolflow develops parts that conduct heat and insulate electricity; knowing each term helps frame the right request.
Heat sink
A part that draws heat away from a source and releases it to the environment. This is Coolflow’s starting point, in applications such as LED lighting and industrial electronics.
CURRENT SCOPEHeat exchanger
Equipment that transfers heat between two fluids, such as water and air. Coolflow does not supply assembled exchangers: it develops thermal materials and components used in that kind of system.
RELATED TERMThermal interface
A layer between two surfaces that lowers resistance to heat flow. Studied in the semiconductor division, validated per application.
UNDER RESEARCHElectrical insulation
Conducting heat without conducting current. It is the core of Coolflow’s dielectric line and must be proven by testing on each part.
DIFFERENTIATORTHE COOLFLOW STORY
From research
to divisions.
Coolflow brings together research, testing and applied development. Early work on LED thermal solutions opened the door to new fronts, now organized into five divisions.
Applied research
Development guided by thermal, electrical, mechanical and manufacturability requirements.
Graphene in the composition
Coolflow contains graphene. Its formulation and processing are proprietary; the contribution of an ingredient should not be confused with measured performance of the final product.
Engineering and scale-up
Design, prototypes and testing guide new parts, manufacturing processes and applications.
Graphene: from science to industrial use
Graphene research accelerated after its isolation and characterization in 2004. Andre Geim and Konstantin Novoselov received the 2010 Nobel Prize in Physics.
In composites, graphene is investigated for possible contributions to thermal and mechanical properties, depending on the formulation and dispersion. The properties of isolated graphene do not automatically describe Coolflow.
Selecting a Coolflow material should be based on documented test results for both the material and finished component, including test conditions, standards and limits.
Scientific reference: 2010 Nobel Prize in Physics ↗03 / APPLICATION OPPORTUNITIES
One material system.
Different challenges.
From LED lighting to electronics and energy systems, each opportunity requires clear requirements, prototypes and independent validation.
01
THERMAL & DIELECTRICLED lighting
Heat sinks and components for luminaires; one of Coolflow’s initial areas of development.
Discuss a project02
SEMICONDUCTORIndustrial electronics
Enclosures, supports and structures designed around both thermal and electrical requirements.
Discuss a project03
ENERGY STORAGEBatteries and energy
Potential parts for modules, battery packs and energy storage; safety and long-term reliability need application-specific testing.
Discuss a project04
MOTIONMotors and motion
Technical parts with friction, wear and dimensional-stability requirements in moving assemblies.
Discuss a projectMATERIAL SELECTION
Compare by function,
not by material name.
Coolflow materials, boron nitride, technical ceramics and encapsulants have different roles. Selection calls for requirements, testing and total component cost.
Coolflow
Each grade needs documented properties and manufacturing options. Review geometry, processing and finished-part test results.
Evaluate injection molding, extrusion, tooling and repeatability for the target design.
Boron nitride (BN)
Used in different matrices and thermal-management formulations. Properties depend on composition and processing.
Compare finished compounds, not just filler powder.
Technical ceramics
Alumina, aluminum nitride and silicon nitride offer distinct specifications for electronics and industrial use.
Check insulation, temperature, strength and production cost.
Encapsulation resins
Epoxies and silicones are chosen for adhesion, humidity, thermal expansion and reliability. They are not necessarily structural alternatives.
Coolflow semiconductor encapsulation remains a hypothesis requiring testing.
Value must be demonstrated in the complete part.
Total cost includes raw material, density, geometry, tooling, production, scrap and assembly. Without equivalent requirements and tests, direct substitution or universal superiority cannot be claimed.
Semiconductor-related applications require process-compatibility, dielectric, thermal-expansion, moisture-absorption and aging tests.
References for other material families: 3M — BN · CeramTec — AlN · Sumitomo Bakelite
04 / FROM MATERIAL TO APPLICATION
Develop. Validate.
Build together.
Coolflow
The technology platform and assessment of industrial applications.
Contém
Material manufacturing and production-capacity development.
Brasmate
Partners for research, product development and new opportunities.
Critical applications require prior validation. This site does not replace specifications, testing or engineering assessment.
05 / FREQUENTLY ASKED QUESTIONS
Before designing,
understand the requirements.
What is Coolflow?+
An industrial materials platform organized into five divisions: semiconductors, energy storage, materials, motion and thermal management. Performance must be specified and validated per application.
How do the divisions relate?+
All of them build on the same formulation and processing research. The chosen division defines the technical scope, the testing requirements and the development stage of the project.
Is Coolflow an electrically insulating metal alloy?+
The phrase “insulating aluminum alloy” has been used as a commercial positioning statement; it is not, by itself, a sufficient technical classification. Any grade must be described in validated technical documentation.
Can it be injection molded or extruded?+
Injection molding and extrusion are industrial processing routes of interest. Grade, processing parameters, tooling and properties of each final geometry must be confirmed.
Can it replace aluminum, ceramics or resins?+
Universal replacement cannot be claimed. Comparison depends on thermal, electrical, mechanical, weight, processing and total-cost requirements.
Can it be used in batteries and semiconductors?+
These remain research opportunities. Battery-pack, power-electronics and encapsulation concepts need prototypes, safety tests and qualification.
Do you develop custom heat sinks?+
Coolflow develops thermal parts from each project’s requirements: geometry, heat load, operating conditions and manufacturing process. Results depend on prototypes and testing of the finished part.
Does Coolflow supply heat exchangers?+
No. Assembled heat exchangers are not part of the current scope. The company works on thermal materials and components that can integrate heat-exchange systems, always with application-specific validation.
What is a dielectric heat sink?+
It is a part that conducts heat while keeping electrical insulation between the heat source and the rest of the assembly. The dielectric property must be measured by testing, for each geometry and operating condition.
THE NEXT STEP STARTS WITH YOUR PROJECT
Which challenge
are you solving?
Tell us which division is closest to your project and share your requirements to explore the feasibility of a Coolflow component.
Contact the team ↗